Edge Server Assembly

Data center edge servers process real-time data near its source to reduce latency and congestion. Operating in enclosed spaces, these systems generate heat and face environmental stress that can compromise performance and lifespan.

Dymax light-curable materials adhere to smaller board-level components and high-density PCBs required for edge computing systems that demand faster, hotter processing. Encapsulants, thermal interface materials, and PCB adhesives manage heat transfer, diminish stress, and protect sensitive components from failure.

Key Applications

• Reinforcement of fine-pitch or leadless components
• Chip-on-board, flex, and glass assembly
• Wire bonding and heat sink mounting
• Bonding heat-sensitive electronic components