Telecom Assembly

Telecom electronics demand adhesives and coatings that ensure reliability in high-density, high-speed applications. Dymax light-curable materials are designed for bonding optical modules and protecting PCB assemblies under thermal, mechanical, and environmental stress. These materials offer precise placement, fast curing, and long-term performance—helping telecom manufacturers meet throughput goals while maintaining signal integrity and durability.

Key Product Capabilities Include:

• Structural adhesives for optical module bonding
• Encapsulants for component protection and shock absorption
• Conformal coatings for long-term reliability and board protection
• Materials designed to maintain signal fidelity under environmental stress

Applications include optical module assembly, fiber-optic bonding, PCB encapsulation and coating, wire and chip protection, and reinforcement of electronics in telecom applications.