가전제품
다이맥스는 회로 보호 및 전자 부품 조립을 위한 광경화성 코팅제, 캡슐화제, 접착제, 마스크제, 포팅 화합물, 와이어 태킹, 견고화 및 열 인터페이스 재료 등 광범위한 포트폴리오를 보유하고 있습니다.
Photo by Anon on Brandfolder
Electronics
Light-Cure Electronics Bonding Solutions for Reliable Performance
Dymax light-curable electronics bonding, coating, and sealing solutions for printed circuit boards, optics, camera modules, EV batteries, and wearables protect critical components from stress, harsh environments, and mechanical wear. These materials ensure durable, reliable performance for consumer electronics, automotive systems, telecommunications, and infrastructure applications.
Electronic adhesives, conformal coatings, encapsulants, form-in-place gaskets, maskants, and potting compounds simplify handling, improve efficiency, and increase throughput. These products have no solvents added, cure rapidly with UV/LED/Visible light, and feature advanced joining capabilities that support sustainability initiatives and high-speed manufacturing operations.
Applications include:
- Active alignment
- Component stabilization
- Optically clear assembly
- Protection from harsh environments
- Resistance to corrosive elements
- Structural support
- Thermal management
특징
- Fast on-demand UV/LED/Visible light cure streamlines production cycles
- High strength bonds ensure the integrity of assembled components
- No-mix, one-part formulations simplify processing and help reduce waste
- No solvents added support worker safety and sustainability initiatives
- Excellent bonding ability to a wide range of glass, plastic, and metal substrates
- See-Cure and fluorescing technologies for visual cure confirmation and inspection
- Multiple viscosities to fit spray, jet, or precision applications
- Rapid curing means no waiting, so efficiency and throughput improve
- Bonding, coating, encapsulating, gasketing, masking, potting, and sealing solutions
- High optical clarity
- Low movement and high stability
